Ceramic Package Ceramic Metal Seal Flatpack Packages (Flatpack) K16.B A e 16 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A INCHES PIN NO. 1 ID AREA -A- D -B- S1 b MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A - 0.115 - 2.92 - b 0.015 0.022 0.38 0.56 - b1 0.015 0.019 0.38 0.48 - c 0.003 0.009 0.08 0.23 - c1 0.003 0.006 0.08 0.15 - E1 0.004 M H A-B S D S 0.036 M H A-B S D S C Q E -D- A -C- -HL E2 E3 SEATING AND BASE PLANE c1 L E3 (c) b1 M M - 0.440 - 11.18 3 E 0.280 0.295 7.24 7.49 - E1 - 0.315 - 8.00 3 E2 0.130 - 3.30 - - E3 0.030 - 0.76 - 7 e LEAD FINISH BASE METAL D SECTION A-A 1.27 BSC - k 0.008 0.015 0.20 0.38 2 L 0.250 0.370 6.35 9.40 - Q 0.026 0.045 0.66 1.14 8 S1 0.005 - 0.13 - 6 M - 0.0015 - 0.04 - N (b) 0.050 BSC 16 16 Rev. 0 5/18/94 NOTES: 1. Index area: A notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the shaded area shown. The manufacturer's identification shall not be used as a pin one identification mark. Alternately, a tab (dimension k) may be used to identify pin one. 2. If a pin one identification mark is used in addition to a tab, the limits of dimension k do not apply. 3. This dimension allows for off-center lid, meniscus, and glass overrun. 4. Dimensions b1 and c1 apply to lead base metal only. Dimension M applies to lead plating and finish thickness. The maximum limits of lead dimensions b and c or M shall be measured at the centroid of the finished lead surfaces, when solder dip or tin plate lead finish is applied. 5. N is the maximum number of terminal positions. 6. Measure dimension S1 at all four corners. 7. For bottom-brazed lead packages, no organic or polymeric materials shall be molded to the bottom of the package to cover the leads. 8. Dimension Q shall be measured at the point of exit (beyond the meniscus) of the lead from the body. Dimension Q minimum shall be reduced by 0.0015 inch (0.038mm) maximum when solder dip lead finish is applied. 9. Dimensioning and tolerancing per ANSI Y14.5M - 1982. 10. Controlling dimension: INCH. 44